Job Description

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Come join us and create what has yet to be imagined. Qualcomm invents foundational technologies that transform how the world connects, computes, and communicates. Building on our legacy of breakthrough development in 5G, Wi-Fi and AI, we design platforms, chipsets, software, tools and services that bring those technologies into end products that change the way we live and work across a range of industries from automotive to virtual reality, from smart cars to smartphones to smart cities, and everything in between. We are a brand of inventors for innovators. When we break through, the world leaps forward.

The Qualcomm Packaging Engineering team is responsible for the roadmap, architecture, design methodology, design implementation and verification for all Qualcomm product packages and the development of packaging solutions in collaboration with cross-functional internal teams and management of outside suppliers to ensure delivery on program timelines and goals.

This senior level leadership position will drive the packaging and substrate technology roadmap for future products to meet form factor, cost reduction, TTM, and market needs based on internal Package Engineering and product teams requirements. You will lead the development of substrate and package technologies needed to enable future product requirements 2 to 5 years on the horizon.

Minimum Qualifications:

• Masters degree in Mechanical/Materials Engineering or equivalent, Ph.D. preferred and a minimum of 15 years of package and substrate technology development, NPI, and continuous improvement experience.
• Expertise in packaging technologies with at least 10 years of experience leading technology teams.
• Excellent communication skills and demonstrated ability to work with various cross-functional teams.
• Excellent presentation skills to help management make technically sound decisions balanced with business requirements.

Duties and Responsibilities Include:

•             Lead building block development for technologies/tools that could be helpful for solving packaging issues.

•             Drive technology development and extension for structures from L0 and maintain through HVM.

•             Define and enable design rules with design team.

•             Drive new material development, reliability data collection, and material selection for products.

•             Drive manufacturing processes characterization and BKM establishment by SAT and substrate suppliers.

•             Define and execute continuous improvement for cost, yield, and reliability.

•             Interface with Quality org on product quality, reliability and RMA issues.

•             Drive supply chain enablement and cost negotiations for materials (co-ownership with sourcing).

Although this role has some expected minor physical activity, this should not deter otherwise qualified applicants from applying. If you are an individual with a physical or mental disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities as part of our ongoing efforts to create an accessible workplace.

Qualcomm is an equal opportunity employer and supports workforce diversity.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.